EP2W-D+ Power Splitter / Combiner Die 50Ω • High Power Handling • Gel-Pak and Partial Wafer • Full Wafer available for EP2K-DF+ & EP2W-DF+ models 
SYPS-2-22HP+ High Power, 2 Way 0° Power Splitter / Combiner 2 to 200 MHz 50Ω • Power Input as a splitter: 5W max. • IP2: 80 dB typ. at 1 W input • IP3: 60 dB at 1W input • Insertion Loss: 0.5 dB typ. • Phase Unbalance: 1 deg. typ. • Amplitude Unbalance: 0.1 dB typ. • Small Size • Good isolation, 22 Db 
EPQ-113+ Wideband 2 Way 90° Power Splitter / Combiner 5 to 11 GHz 50Ω • Insertion Loss: 0.6 dB typ. at 7 to 9 GHz • Isolation: 19 dB typ. at 7 to 9 GHz • Power Input as splitter: 30 dBm max. • Amplitude Unbalance: 0.8 dB typ. • Phase Unbalance: 3.7 deg. typ. • VSWR: 1.2:1 typ. • Highly repeatable performance (GaAs based design) • No external termination required • Wideband (5-11 GHz) • High power handling (>30dBm) • Small Size MCLP 4x4mm 
QCH-272+ High Power 2 Way-90° Power Splitter 700 to 2700 MHz 50Ω • Power Handling: 200 Watt max. • Amplitude Unbalance: ±0.1 dB typ. • Phase Unbalance: ±0.9 deg. typ. • Insertion Loss: 0.3 dB typ. • Isolation: 22 dB typ. • VSWR: 1.15:1 typ. • Wide bandwidth 
ZA3CS-400-3W+ 3 Way 0° High Power Combiner 2 to 400 MHz 50Ω • Insertion Loss: 0.5 dB typ. • Isolation: 25 dB typ. • Amplitude Unbalance: 0.15 dB typ. • Phase Unbalance: 0.2 dB typ. • Power Input as Splitter: 10W max. • Connectors: BNC, N-type, SMA available • Wideband, 2 to 400 MHz
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