EP2W-D+

Power Splitter / Combiner Die

50Ω

• High Power Handling

• Gel-Pak and Partial Wafer

• Full Wafer available for EP2K-DF+ & EP2W-DF+ models

SYPS-2-22HP+

High Power, 2 Way 0° Power Splitter / Combiner

2 to 200 MHz 50Ω

• Power Input as a splitter: 5W max.

• IP2: 80 dB typ. at 1 W input

• IP3: 60 dB at 1W input

• Insertion Loss: 0.5 dB typ.

• Phase Unbalance: 1 deg. typ.

• Amplitude Unbalance: 0.1 dB typ.

• Small Size

• Good isolation, 22 Db

EPQ-113+

Wideband 2 Way 90° Power Splitter / Combiner

5 to 11 GHz 50Ω

• Insertion Loss: 0.6 dB typ. at 7 to 9 GHz

• Isolation: 19 dB typ. at 7 to 9 GHz

• Power Input as splitter: 30 dBm max.

• Amplitude Unbalance: 0.8 dB typ.

• Phase Unbalance: 3.7 deg. typ.

• VSWR: 1.2:1 typ.

• Highly repeatable performance (GaAs based design)

• No external termination required

• Wideband (5-11 GHz)

• High power handling (>30dBm)

• Small Size MCLP 4x4mm

QCH-272+

High Power 2 Way-90° Power Splitter

700 to 2700 MHz 50Ω

• Power Handling: 200 Watt max.

• Amplitude Unbalance: ±0.1 dB typ.

• Phase Unbalance: ±0.9 deg. typ.

• Insertion Loss: 0.3 dB typ.

• Isolation: 22 dB typ.

• VSWR: 1.15:1 typ.

• Wide bandwidth

ZA3CS-400-3W+

3 Way 0° High Power Combiner

2 to 400 MHz 50Ω

• Insertion Loss: 0.5 dB typ.

• Isolation: 25 dB typ.

• Amplitude Unbalance: 0.15 dB typ.

• Phase Unbalance: 0.2 dB typ.

• Power Input as Splitter: 10W max.

• Connectors: BNC, N-type, SMA available

• Wideband, 2 to 400 MHz